Needham 6th Annual Virtual Semiconductor & Semicap 1×1 Conference
2025-08-20 | Virtual
The 6th Annual Needham Virtual Semiconductor & SemiCap 1×1 Conference will take place on August 20-21, 2025. Company participants will include some of the most prominent C-level management teams in the Semiconductor and Semiconductor Capital Equipment ecosystems. This event consists of virtual 1×1 and group meetings.
1-on-1 meetings with Gene Sheridan, CEO, and Todd Glickman

Evercore 2025 Semiconductor, IT Hardware & Networking Conference
2025-08-26 | Peninsula Hotel, 108 E Superior St, Chicago, IL, IL 60611, United States
August 26, 2025, 1-on-1 meetings with Gene Sheridan, CEO, and Todd Glickman, CFO

Deutsche Bank 2025 Technology Conference
2025-08-27 | Waldorf Astoria Dana Point, 1 Monarch Beach Resort N., Dana Point, CA, CA 92629, United States
Senior executives from leading companies in the technology industry will provide updates to you on their businesses. The format will be focused on more one-on-one / small group meetings in order to connect corporate management teams and investors. Presentations and panel discussions will also be an agenda highlight.
August 28, 2025, 1-on-1 meetings with Gene Sheridan, CEO, and Todd Glickman, CFO

SEMI-e 2025
2025-09-10 - 2025-09-11 | Shenzhen World Exhibition & Convention Center, 福海街道展城路1号 邮政编码, Shenzhen, Baoan, 518103, China
Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025), a premier global event in the semiconductor industry, will bring together more than 1,000 distinguished global exhibitors to showcase the entire industry chain. Spanning from EDA tools, semiconductor materials, equipment manufacturing to chip design and advanced packaging applications. The exhibition features seven dedicated theme pavilions, including Chip Design and Application, IC Fabrication, Wafer Equipment, Advanced Packaging Equipment, Semiconductor Core Part & Raw Material, Compound Semiconductors & Power Devices, AI Computing Power.

Asia Charging Expo (Fall) 2025
2025-09-12 | Qianhai International Convention Center, Qianhai Enterprise Mansion, 63 Qianwan Road, Qianhai Cooperation Zone, Shenzhen, China
The Asia Charging Expo (ACE), is one of the world’s most influential energy electronics technology exhibitions and one of the leading charging industry technology events in Asia. Thanks to its strong professionalism and targeted reach of exhibitors and visitors, the Asia Charging Expo enjoys considerable global recognition. It has become a platform for major global power supply companies to release product information and showcase their latest technologies.

ICSCRM 2025
2025-09-14 - 2025-09-18 | Bexco (Busan Exhibition & Convention Center), 55 APEC-ro, Haeundae-gu, Busan, 48060, Korea, Republic of
ICSCRM 2025 promises an exceptional program, comprising top-tier tutorials, keynote lectures, and an array of oral and poster presentations, all backed by the Technical Program Committee. In addition to the technical program, an exhibition showcasing the latest technologies and products in the field of silicon carbide and related materials will run concurrently.
Event Details:
Booth:
#092
Presentations:
Sid Sundaresan – Session Chair
“Devices Physics, Design, and Characterization”
September 16th 2:45pm – 4:15pm KST
Arash Salemi
“Benchmark Study of State-of-The-Art Commercial 1200V SiC MOSFETs for Automotive Applications”
September 17th 4:30pm – 6:30pm KST

electronica India 2025
2025-09-17 - 2025-09-18 | Bangalore International Exhibition Centre (BIEC), 10th Mile, Tumkur Main Road , Madavara Post Dasanapura, Hobli, Bengaluru, Karnataka, 562123, India
electronica India gathers international and local market leaders from the industry, displays products, addresses all important target groups and thus creates the best communication and business environment for both sides.
Event Details:
Navitas x JPE Booth:
Hall 5, #D21

ECCE Conference 2025
2025-10-19 - 2025-10-22 | Philadelphia, Philadelphia, PA, United States
The ECCE 2025 Conference will feature both industry-driven and application-oriented technical sessions, as well as expositions. ECCE will bring together practicing engineers, researchers and other professionals for interactive and multidisciplinary discussions on the latest advances in various areas related to energy conversion.

ASME InterPACK 2025
2025-10-28 - 2025-10-29 | Hotel FERA Anaheim, 100 The City Dr S, Orange, CA, CA 92868, United States
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.
Presentations:
Jinesh Narangaparambil
“Long-Term-Reliability Analysis of Top Cooled GaN Package Under Thermal Cycling”
October 28th 11:15 am – 12:45 pm PDT

PowerAmerica Technical Webinar
2025-11-05 | Virtual
Technical Webinar – Dr. Arash Salemi
This event is free and does not require registration. Please feel free to share the link with colleagues and students.
Where: Online via Zoom
When: Wednesday, November 5, from Noon to 1 p.m. (EDT)
Topic: 3300 V & 2300 V SiC Trench-Assisted Planar MOSFETs and Compact Power Modules with Epoxy-Resin Potting Technology for Energy Infrastructure Applications

Wide Bandgap Power Devices and Applications (WiPDA 2025)
2025-11-10 - 2025-11-11 | Fayetteville, Fayetteville, AR, United States
WiPDA provides a forum for device scientists, circuit designers, and application engineers to share technology updates, research findings, experience, and potential applications. WiPDA 2025 will feature technical sessions, tutorials, keynotes from industry and research leaders, as well as an exposition.
Presentations:
Sid Sundaresan & Jaehoon Park
“Industry View on the status and challenges for UHV SiC Power Device Technologies”
November 11th 8:50 AM – 9:20 AM CST

ECPE Hybrid Workshop 2025
2025-11-12 | Lyon, Lyon, France
ECPE, the European Center for Power Electronics e.V., founded in 2003, is the leading industry-driven research network in the field of power electronics in Europe, with more than 230 member organizations, including member companies and competence centers.
Presentations:
Dr. Arash Salemi
“Revolutionizing Ultra-High-Voltage Power SiC MOSFETs from 650V to 15kV”
November 12th 12:45 PM – 1:15 PM CET

Bodo’s Wide Bandgap Event 2025
2025-12-02 | Hilton Munich Airport, Terminalstraße Mitte 20, 85356 München-Flughafen, Germany
Presentations:
Llew Vaughan-Edmunds
“Bodo’s WBG – Opening Roundtable”
December 2nd 4:00 PM ~ 5:30 PM CET
Llew Vaughan-Edmunds
“High-Power GaN ICs & FETs Enable Efficiency and Power Density Requirements in Next Gen 800V AI Data Centers”
December 3rd 11:45 AM – 12:00 PM CET
Sascha Dern
“Performance and Reliability Gains in MVHV SiC Using Advanced Power Devices and Packaging Technologies”
December 3rd 2:30 PM – 2:45 PM CET

UBS Global Technology and AI Conference 2025
2025-12-03 | The Phoenician, 6000 E Camelback Rd, Scottsdale, AZ, AZ 85251, United States
1-on-1 meetings with Chris Allexandre, President and CEO, and Todd Glickman, CFO

28th Annual Needham Growth Conference
2026-01-14 | Lotte New York Palace Hotel, 455 Madison Ave, New York, NY, NY 10022, United States
Fireside Chat: Wednesday, January 14th at 2:15pm EST
Presenter: Chris Allexandre, CEO
1×1 meetings with attending investors available throughout the day
Webcast Link: https://wsw.com/webcast/needham148/nvts/2305989

APEC 2026 - San Antonio, TX
2026-03-22 - 2026-03-26 | Henry B. Gonzalez Convention Center, 900 E Market St, San Antonio, TX, TX 78205, United States
Navitas will be exhibiting solutions for AI data center, performance computing, grid and energy infrastructure, and industrial electrification at APEC 2026 from March 22–26, 2026, in San Antonio, Texas. Visit us at booth #2027 to learn more about our SiC and GaN products, solutions and industry sessions:
Products:
• Ultra-high voltage (UHV) 3300 V and 2300 V press-fit modules with epoxy–resin potting technology, along with high-voltage 1200 V solutions based on latest Trench Assisted planar (TAP) architecture in SiCPAK™ power modules. A gate driver evaluation board for dynamic characterization of UHV SiCPAK power modules will also be on display.
• Latest TO-247 (low-height) and QDPAK package solutions, including 1200 V SiC based technology, for AI data center power supplies.
• New bare die products called Known Good Die (KGD) on 3300 V, 2300 V, 1700 V and 1200 V technology nodes for customizable power modules for grid and energy infrastructure applications.
• GaNFast™ FETs, ranging from 0.8mOhms at 100V to 11mOhms at 650 V in industry leading packages.
• GaNSafe™ ICs for specifically created to serve demanding, high-power applications, such as AI data centers, and industrial electrification. Navitas 4th generation integrates control, drive, sensing, and critical protection features that enable unprecedented reliability and robustness.
• Bi-directional GaN for single-stage conversion, enabling the transition from two-stage to single-stage topologies, to provide the highest efficiency, power density, and performance, while reducing system cost and complexity.
• A new family of GaNSlim™ Control ICs have been released to further simplify and speed up the development of small form factor, high-power-density applications by offering the highest level of integration and thermal performance. Target markets include auxiliary PSUs for data centers and high-performance computing.
AI Data Center Solutions:
• The all-GaN 10 kW 800 V–to–50 V DC-DC platform that employs advanced 650 V, NV6066,in TOLT package and 100 V, NVG011C10LC GaNFast FETs in a three-level half-bridge architecture with synchronous rectification to deliver 98.5% peak efficiency. This full-brick package design platform achieves 2.1 kW/in³ power density and supports + / – 400 VDC standard for AI datacenters.
• 12 kW AI data center power supply, which leverages IntelliWeave™ digital control to achieve unmatched efficiency, power density, and performance for OCP PSU.Designed for production, this power supply achieves 97.8% efficiency for high-power-density hyperscale AI data centers, enabled by GaNSafe ICs and GeneSiC™ MOSFETs.
• World’s first 8.5 kW AI data center OCP PSU, achieving 98% efficiency for AI and hyperscale data centers using GaNSafe ICs and GeneSiC™ MOSFETs.
• World’s highest power density 4.5 kW AI CRPS PSU leveraging GaNSafe devices and GeneSiC™ MOSFETs in the smallest power-supply form factor for the latest AI GPUs, which demand 3× more power per rack – enabling the world’s highest power density at 137 W/in³ with over 97% efficiency.
Industrial Electrification Solutions:
• 400 W – 1 kW motor drive boards using GaNSense™ Motor Drive ICs, delivering industry-leading performance, efficiency, and robustness for industrial applications.
• 45W Auxiliary SMPS based on 1.7 kV SiC technology.
• A 250KW DC-DC converter with an output of 950VDCat 480A, and can be paralleled to achieve megawatt power capability, developed by one of our key partners, Brightloop will also be on display.
Performance Computing Solutions:
• 300 W, 240 W, and 140 W ultra compact and highly efficient SMPS solutions using GaNFast power devices for the next-generation of AI computers, significantly reducing weight and thermal management requirements.
Grid and Energy Solutions:
• For solid-state transformers (SST) application requiring high-efficiency power conversion such as over 98 % efficiency from medium voltage grid, that is, 13.8 kVAC – 34.5 kVAC to 800 VDC or 1500 VDC targeting AI data centers and grid and energy infrastructure segments.
• Evaluation boards that allow easy and quick dynamic characterization of our UHV SiCPAK rated at 3300 V and 2300 V will be showcased.
Industry sessions:
• March 24 | 8:55–9:20 AM CT
IS01.2 – Maximizing MVHV SiC Performance and Reliability with Advanced Power Device and Packaging Technologies for Mission-Critical Energy Infrastructure Applications
Presenter: Sumit Jadav, Navitas Semiconductor
• March 25 | 11:05–11:30 AM CT
IS07.6 – High-Power GaN ICs Deliver Leading Efficiency and Power Density in 800 V AI Data Center DC-DC Brick Solutions
Presenter: Llew Vaughan-Edmunds, Vice President & GM, GaN Business Unit & Bin Li, Director, Applications Engineer
• March 26 | 11:35–11:50 AM CT
IS27.4 – Single-stage Power Converter Enabled by GaN Bidirectional Switches
Presenter: Llew Vaughan-Edmunds, Vice President & GM, GaN Business Unit & Bin Li, Director, Applications Engineer
Exposition hours are:
Monday, March 23 (4:45 PM – 7:45 PM)
Tuesday, March 24 (9:00 AM – 4:30 PM), and
Wednesday, March 25 (9:00 AM – 2:30 PM)
We look forward to seeing you at our booth! If you are interested in scheduling a meeting, please reach out to your Navitas representative or write to info@navitassemi.com.
