“At a macro level, GaN is expected to address CO2 emissions of 2.6 Gtons/year by 2050 as we work to ‘Electrify Our World™’ and meet the challenge of the Paris Accord,” said Mr. Kinzer. “Even at a micro level, due to small size and integrated functions, a GaN power IC has up to a 10x smaller carbon footprint in manufacturing than a legacy power silicon chip. Add that to GaN’s ‘in-use’ contribution to smaller, lighter, more efficient end applications then for every IC shipped, GaN saves 4kg CO2 compared to silicon.”
