Bi-Directional GaNFast™ Switches Open Doors for New High-Performance Topologies |
2024/12 (Dec) |
Conference |
Bodo's Wide Bandgap Event 2024 |
|
Driving Electric Motors with GaN Power ICs |
2024/12 (Dec) |
Conference |
Bodo's Wide Bandgap Event 2024 |
|
GaN & SiC Technologies Enable Next-Gen AI Data Centers |
2024/12 (Dec) |
Conference |
Bodo's Wide Bandgap Event 2024 |
|
Achieving Next Generation Power Density and Efficiency for AI and Hyperscale Data Center PSUs |
2024/11 (Nov) |
White Paper |
White Paper |
|
The Environmental Footprint of Wide Bandgap Semiconductors Versus Silicon in CRPS PSUs for AI Data Centers |
2024/11 (Nov) |
Article |
Electronic Specifier |
|
Power Delivery Roadmap for AI |
2024/11 (Nov) |
Article |
EPD&T |
|
Power Density in AI Data Center PSUs: How Do We Move Above 100 W/In3 |
2024/11 (Nov) |
Article |
Bodo's Power Systems |
|
Wide Bandgap Goes Mainstream |
2024/11 (Nov) |
Article |
EE Power |
|
GeneSiC Power Devices |
2024/11 (Nov) |
Brochure |
Brochure |
|
GaNFast Power ICs |
2024/11 (Nov) |
Brochure |
Brochure |
|
World’s First 8.5 kW PSU for AI Data Centers using only GaN and SiC |
2024/11 (Nov) |
Product Brief |
Product Brief |
|
A Novel Digital Control Strategy for GaN-based Interleaving CrM Totem-pole PFC |
2024/10 (Oct) |
White Paper |
ECCE 2024 |
|
High-Voltage SiC Accelerates Heavy-Duty EV Trucking |
2024/10 (Oct) |
Conference |
PowerUP 2024 |
|
Robust GaN Power ICs Drive into High-Power, High-Reliability Systems |
2024/10 (Oct) |
Conference |
PowerUP 2024 |
|
High-Voltage SiC for Storage & MV-Grid Conversion |
2024/09 (Sep) |
Article |
Power Electronics World |
|
AN031: GaNSlim 系列产品用在LLC电路上的设计指导 |
2024/08 (Aug) |
App Note |
Application Note |
|
AN031: Design Guide for GaNSlim Serial Products Used in LLC Circuit |
2024/08 (Aug) |
App Note |
Application Note |
|
Advances in SiC Technologies Address High-Voltage Electrification Design Challenges |
2024/06 (Jun) |
Article |
IEEE |
|
PCIM 2024 – GaN Wide Bandgap Design the Future of Power (Bodos Panel) |
2024/06 (Jun) |
Conference |
PCIM 2024 |
|
Bi-Directional GaN Power ICs open up new possibilities in off-grid applications |
2024/04 (Apr) |
Conference |
PE International 2024 |
|
3.3 kV SiC MOSFETs Accelerate Grid-Connected Energy Storage |
2024/04 (Apr) |
Conference |
PE International 2024 |
|
Navitas Delivers AI Server Power: GaN & SiC Hybrid 4.5 kW |
2024/03 (Mar) |
Conference |
TechTaiwan |
|
Silicon Carbide MPS Diodes Boost Efficiency and Reliability |
2024/03 (Mar) |
Article |
Compound Semiconductor |
|
Driving up Power Density with GaN |
2024/03 (Mar) |
Article |
EPD&T |
|
Wide Bandgap Power to Electrify Our World for a Sustainable Future |
2024/03 (Mar) |
Article |
IEEE |
|
High-Density Power for the AI Revolution |
2024/02 (Feb) |
Article |
EE World Online |
|
High Density 400 W DC/DC Power Module with Integrated Planar Transformer and Half Bridge GaN IC |
2024/02 (Feb) |
Conference |
APEC |
|
High-Voltage SiC Optimized for Megawatt Charging in EV Long-haul Trucking |
2024/02 (Feb) |
Conference |
APEC |
|
An Optimization Method for Planar Transformer Winding Losses in GaN Based Multi-Output Flyback Converter |
2024/02 (Feb) |
Conference |
APEC |
|
GaN and SiC Based 500kHz Resonant Bi-directional DC/DC Design for 800V OBCM Application (paper) |
2024/02 (Feb) |
Conference |
APEC |
|
GaN and SiC Based 500kHz Resonant Bi-directional DC/DC Design for 800V OBCM Application (poster) |
2024/02 (Feb) |
Conference |
APEC |
|
“Electrify Our World” with Next-gen GaNFast and GeneSiC Power |
2024/02 (Feb) |
Conference |
APEC |
|
GaN Half-Bridge Power IC and AHB/Totem-Pole Topologies Enable 240W, 150cc, PD3.1 Solution with 95.5% Efficiency |
2024/02 (Feb) |
Conference |
APEC |
|
Reducing System Cost with GaN FETs in Motor Drive Applications |
2024/02 (Feb) |
Conference |
APEC |
|
The SiC Evolution and GaN Revolution for Electric Vehicles |
2024/01 (Jan) |
Article |
Power Systems Design |
|
Traction, Charging and Sustainability – Addressing High-Voltage EV Challenges with SiC |
2023/12 (Dec) |
White Paper |
Design World |
|
GaN power IC Innovations For High-Frequency, High-Power Industrial Motor Drive |
2023/12 (Dec) |
Conference |
Bodo's Wide Bandgap Event 2023 |
|
High-Speed Gen3 Fast GeneSiC MOSFETs Deliver Best-In-Class Performance |
2023/12 (Dec) |
Conference |
Bodo's Wide Bandgap Event 2023 |
|
Reliability and Cost-of-Ownership Optimization in Industrial Power Supplies |
2023/11 (Nov) |
Conference |
Power Semiconductor User Forum 2023 |
|
A New Generation of GaN Devices to Meet AI Server Power Demands |
2023/11 (Nov) |
Article |
Power Systems Design |
|
SiC-based Bidirectional Three-phase CLLLC Resonant Converter with Integrated Magnetics for High-Power On-Board Charger Applications |
2023/11 (Nov) |
White Paper |
CPSSC |
|
Next-Generation GaN power ICs Drive Transformer Revolution |
2023/11 (Nov) |
Conference |
CPSSC |
|
How the Si to GaN SiC Transition Accelerates Our Journey From Fossil Fuels |
2023/11 (Nov) |
Conference |
CPSSC |
|
Empowering Zero Carbon Unleashing the Potential of Navitas GaN in Solar and Energy Storage Systems |
2023/11 (Nov) |
Conference |
CPSSC |
|
Successful High-Frequency Applications with SiC |
2023/11 (Nov) |
Conference |
CPSSC |
|
3rd-Gen Device Drives Ultra Power Density CRPS185 3,200 W Titanium Server Design (Chinese) |
2023/11 (Nov) |
Conference |
CPSSC |
|
High Power, High Voltage, High Speed: GaN and SiC Electrify Our World™ |
2023/11 (Nov) |
Conference |
CPSSC |
|
纳微GaNsafe™ 驱动超高性能AI服务器电源设计 |
2023/11 (Nov) |
Conference |
CPSSC |
|
采用无损电流采样的高集成GaNSense Control和GaN Halfbridge方案 |
2023/11 (Nov) |
Conference |
CPSSC |
|
GaNSafe™ Power ICs Create Highest Density and Efficiency in Data Center & EV Power Systems |
2023/11 (Nov) |
Conference |
CPSSC |
|
GaN Power ICs Drive Efficiency and Size Improvements in BLDC Motor Drive Applications |
2023/11 (Nov) |
Conference |
CPSSC |
|
Navitas GaNSafe™️ and GeneSiC™️ Double Engine Drive Automotive Power Future |
2023/11 (Nov) |
Conference |
CPSSC |
|
全面保护型半桥功率IC赋能电机集成逆变器 |
2023/10 (Oct) |
Article |
Bodo's Power China |
|
AN022: PCB Layout Recommendations for GeneSiC MOSFETs |
2023/10 (Oct) |
App Note |
Application Note |
|
GaNFast: The Power and the Quality |
2023/10 (Oct) |
eBook |
eBook |
|
AN030: SPICE Model Usage Instructions |
2023/10 (Oct) |
App Note |
Application Note |
|
AN029: Understanding the Datasheet of a SiC Power Schottky Diode |
2023/10 (Oct) |
App Note |
Application Note |
|
AN028: SiC Power Diode Reliability |
2023/10 (Oct) |
App Note |
Application Note |
|
New-Generation SiC MPS Diodes with low knee voltages |
2023/09 (Sep) |
Conference |
ICSCRM 2023 |
|
New-Generation of Trench-Assisted Planar SiC MOSFETs |
2023/09 (Sep) |
Conference |
ICSCRM 2023 |
|
Variable-Speed Motor Drives Reap Benefits Of Integrated GaN |
2023/09 (Sep) |
Article |
How2Power |
|
GaNSafe – the World’s Safest GaN Power Semiconductor |
2023/09 (Sep) |
White Paper |
Semicon |
|
GaNSafe Power ICs Create Highest Density and Efficiency in Data Center and EV Power Systems |
2023/09 (Sep) |
Conference |
Semicon |
|
GaN & SiC: Accelerating Revolutions (Video) |
2023/07 (Jul) |
Conference |
Aspencore PowerUp 2023 |
|
GaN & SiC: Accelerating Revolutions (PDF) |
2023/07 (Jul) |
Conference |
Aspencore PowerUp 2023 |
|
The Genesis of GeneSiC and the Future of Silicon Carbide |
2023/07 (Jul) |
Article |
Bodo's Power Systems |
|
GaNSense™ Power ICs Integrate Fast, Autonomous, Precise Protection Circuits for Ultimate System Robustness |
2023/06 (Jun) |
Article |
Power Systems Design |
|
AN027: 1200 V SiC JBS Diodes With Ultra-Low Capacitive Reverse Recovery Charge For Fast Switching Applications |
2023/06 (Jun) |
App Note |
Application Note |
|
AN026: 1200 V Schottky Diodes With Temperature Invariant Barrier Heights and Ideality Factors |
2023/06 (Jun) |
App Note |
Application Note |
|
GaNSense™ Power ICs Enable Next-Gen, Ultra-High-Efficiency and High-Power-Density 140 W, PD3.1 Adapter Designs |
2023/05 (May) |
Article |
Bodo's Power Systems |
|
3.3 kV SiC MOSFETs Accelerate Grid-Connected Energy Storage |
2023/05 (May) |
Article |
Power Electronics News |
|
High-Frequency High-Efficiency LLC Module with Planar Matrix Transformer for CPRS Application Using GaN Power IC |
2023/05 (May) |
White Paper |
PCIM Europe 2023 |
|
GaN Power ICs Drive Efficiency and Size Improvements in BLDC Motor Drive Applications |
2023/05 (May) |
White Paper |
PCIM Europe 2023 |
|
GaN Power ICs Enable 300cc 700kHz 300W AC-DC Converter |
2023/05 (May) |
White Paper |
PCIM Europe 2023 |
|
GaN-based High Frequency and High-power Density 2-in-1 Bidirectional OBCM Design for EV Application |
2023/05 (May) |
White Paper |
PCIM Europe 2023 |
|
High-Frequency High-Efficiency LLC Module with Planar Matrix Transformer for CPRS Application Using GaN Power IC |
2023/05 (May) |
Conference |
PCIM Europe 2023 |
|
GaN Power ICs Drive Efficiency and Size Improvements in BLDC Motor Drive Applications |
2023/05 (May) |
Conference |
PCIM Europe 2023 |
|
GaN Power ICs Enable 300cc 700kHz 300W AC-DC Converter |
2023/05 (May) |
Conference |
PCIM Europe 2023 |
|
GaN-based High Frequency and High-power Density 2-in-1 Bidirectional OBCM Design for EV Application |
2023/05 (May) |
Conference |
PCIM Europe 2023 |
|
AN021: Gate-Driver IC Selection Guidelines for GeneSiC MOSFETs |
2023/05 (May) |
App Note |
Application Note |
|
An Ultra-High Efficiency High Power Density 140W PD3.1 AC-DC Adapter Using GaN Power ICs |
2023/04 (Apr) |
Conference |
APEC 2023 |
|
GeneSiC high-speed, high-voltage SiC drives high-power innovation |
2023/04 (Apr) |
Conference |
APEC 2023 |
|
The Past, Present, and Future of Current Sensing |
2023/04 (Apr) |
Conference |
APEC 2023 |
|
New GaNSense Half-Bridge IC Enables Next Gen High-Frequency, High-Efficiency, High-Density Topologies |
2023/04 (Apr) |
Conference |
APEC 2023 |
|
Pure-Play, High-Speed GaNFast and GeneSiC |
2023/04 (Apr) |
Conference |
APEC 2023 |
|
Sustainability Benefits of GaNFast Power ICs |
2023/04 (Apr) |
Conference |
APEC 2023 |
|
Efficient 400-800V Charging & Conversion with GaNFast Power ICs & GeneSiC Trench-Assisted Planar-Gate MOSFETs |
2023/03 (Mar) |
Conference |
Advanced Automotive Tech Forum 2023 |
|
Beyond Simply Replacing Silicon – System Level Impact of GaN Power ICs in Key Applications |
2023/03 (Mar) |
Conference |
ECPE 2023 |
|
AN020: Thermal Simulation Model |
2023/03 (Mar) |
App Note |
Application Note |
|
SiC Delivers Next-Generation Efficiency and Sustainability |
2023/03 (Mar) |
Article |
Power Systems Design |
|
Navitas GaNFast™ IC Field Results in High-Volume Production |
2023/02 (Feb) |
Article |
Navitas Semiconductor |
|
AN019: New GaNFast™ Half-Bridge Power ICs with GaNSense™ Technology |
2023/02 (Feb) |
App Note |
Application Note |
|
Planet Navitas Showcases Tomorrow’s Sustainable World at CES 2023 |
2023/01 (Jan) |
Article |
EE Times Asia |
|
Charging Into The GaNFast Future – Ugreen |
2023/01 (Jan) |
Conference |
CES 2023 |
|
The Power of GaNFast Technology on the OnePlus 10T-5G |
2023/01 (Jan) |
Conference |
CES 2023 |
|
Anker 767 PowerHouse – GaNPrime 2048Wh | 2400W |
2023/01 (Jan) |
Conference |
CES 2023 |
|
Something You Want With Navitas GaN – Spigen |
2023/01 (Jan) |
Conference |
CES 2023 |
|
The Silicon Chip is Dead! |
2023/01 (Jan) |
Conference |
CES 2023 |
|
Living Well Off the Grid |
2023/01 (Jan) |
Conference |
CES 2023 |
|
Electrify Our World |
2023/01 (Jan) |
Conference |
CES 2023 |
|
From 650V to 6.5 kV, GeneSiC MOSFETs Drive Innovation |
2022/11 (Nov) |
Conference |
Bodo's Wide Bandgap |
|
Electric motors benefit from GaNFast™ |
2022/11 (Nov) |
Conference |
Bodo's Wide Bandgap 2022 |
|
GaNFast Power ICs Maximize Transient Voltage Ratings and Boost Circuit Ruggedness |
2022/11 (Nov) |
Article |
Power Systems Design |
|
Pure-Play, Next-Generation Power Semiconductors |
2022/11 (Nov) |
Conference |
CPSSC |
|
GaNFast™ Half-Bridge IC and Applications |
2022/11 (Nov) |
Conference |
CPSSC |
|
GaNFast™ and GeneSiC™: Twin Engines Drive the Future of High-Power Applications |
2022/11 (Nov) |
Conference |
CPSSC |
|
GaN Integration Drives Next-Generation Power Systems |
2022/11 (Nov) |
Conference |
CPSSC |
|
GaN-based High Frequency 6.6kW Bi-directional DCDC Converter for OBC Application |
2022/11 (Nov) |
White Paper |
CPSSC |
|
SiC and GaN Applications in Electric Vehicles: Current Issues |
2022/10 (Oct) |
Conference |
ECCE |
|
GaN Drives Development of Next-Generation EVs |
2022/10 (Oct) |
Article |
Power Systems Design |
|
GaN ICs Drive Sustainability and Deliver CarbonNeutral Status |
2022/10 (Oct) |
Article |
Power Electronics News |
|
Advancing GaN Power ICs: Efficiency, Reliability & Autonomy |
2022/09 (Sep) |
Conference |
EPE |
|
GaNSense™ 半桥集成技术加速电力电子技术革命 |
2022/09 (Sep) |
Article |
EET China |
|
GaNSense™ Half-Bridge Integration Accelerates the Power-Electronics Revolution |
2022/09 (Sep) |
Article |
Power Electronics News |
|
Current Sensing: Past, Present, and Future |
2022/08 (Aug) |
Article |
Electronic Design |
|
Advancing GaN Power Integration: Efficiency, Reliability & Autonomy |
2022/08 (Aug) |
Conference |
PowerAmerica |
|
Vollständig geschützte GaN-Leistungs-ICs sorgen für robuste und kostengünstige Motorantriebe |
2022/07 (Jul) |
Article |
Elektronik |
|
Fully-Protected GaN Power ICs Deliver Robustness and Lower System Costs to Motor Drives |
2022/07 (Jul) |
Article |
Elektronik |
|
TSMC Technology Symposium 2022 |
2022/07 (Jul) |
Conference |
Presentation |
|
GaN ICs Simplify Designs, Improve Performance and Boost Robustness & Reliability |
2022/06 (Jun) |
White Paper |
White Paper |
|
Bodo’s Panel: The Industry Leader in GaN Power ICs |
2022/05 (May) |
Conference |
PCIM |
|
采用了GaNSense™技术的NV6169 PQFN 8×8 GaNFast™功率IC,适用于更高功率的应用 |
2022/05 (May) |
App Note |
Application Note |
|
AN016: NV6169 PQFN 8×8 GaNFast™ Power IC with GaNSense™ Technology for Higher-Power Applications |
2022/05 (May) |
App Note |
Application Note |
|
Autonomous GaN Power ICs Deliver High-Performance, Reliable Motor Drives |
2022/05 (May) |
White Paper |
White Paper |
|
Reducing Consumer Electronics’ impact with Gallium Nitride (GaN) Power Semiconductors |
2022/04 (Apr) |
White Paper |
White Paper |
|
GaN Reliability: Beyond Performance and Efficiency |
2022/04 (Apr) |
White Paper |
White Paper |
|
GaNFast™ 20-Year Warranty (Chinese) |
2022/03 (Mar) |
White Paper |
White Paper |
|
GaNFast™ 20-Year Warranty |
2022/03 (Mar) |
White Paper |
White Paper |
|
GaN Half-Bridge ICs Enable Next Gen MidPower, Multi-Port, High-Density Charger Topologies |
2022/03 (Mar) |
Conference |
APEC |
|
Advancements in GaN Power IC System Integration |
2022/03 (Mar) |
Conference |
APEC |
|
Navitas Exhibitor Seminar |
2022/03 (Mar) |
Conference |
APEC |
|
GaN Adoption, Market-by-Market |
2022/03 (Mar) |
Conference |
APEC |
|
Chinese Sustainability Report 2021 |
2022/02 (Feb) |
White Paper |
White Paper |
|
Sustainability Report 2021 |
2022/02 (Feb) |
White Paper |
White Paper |
|
AN015: 具有无损电流检测和自动保护功能的GaNSense™技术的新一代GaNFast™Power ICs |
2021/12 (Dec) |
App Note |
Application Note |
|
AN015: New GaNFast™ Power ICs with GaNSense™ Technology Loss-Less Current Sensing & Autonomous Protection |
2021/12 (Dec) |
App Note |
Application Note |
|
Bodo’s Wide Bandgap Event: GaNFast™ Power IC Solutions for EV, Solar & Industrial |
2021/12 (Dec) |
Conference |
Bodo's Wide Bandgap |
|
Bodo’s Wide Bandgap Event: GaNFast™ Architecture, Performance in High-Power Systems |
2021/12 (Dec) |
Conference |
Bodo's Wide Bandgap |
|
Next-Generation Gallium Nitride Semiconductor Accelerates Carbon Neutrality |
2021/12 (Dec) |
Conference |
Nomura |
|
Power Up Virtual Expo: Electrify Our World™ |
2021/12 (Dec) |
Conference |
PowerUP |
|
Advances in GaN Power ICs: Efficiency, Reliability & Autonomy |
2021/11 (Nov) |
Conference |
WiPDA |
|
Electronica South China – Navitas |
2021/11 (Nov) |
Conference |
Electronica |
|
Electrifying Our World: The Navitas Quality Journey |
2021/11 (Nov) |
White Paper |
White Paper |
|
GaN Technology Enables Fast Electric Charging Systems |
2021/08 (Aug) |
Article |
EE Times |
|
Gallium Nitride (GaN) Enables Next-Generation High-Frequency Circuits |
2021/07 (Jul) |
White Paper |
White paper |
|
Gallium Nitride (GaN) Power ICs: Turning Academic Dreams into Industry Reality |
2021/07 (Jul) |
White Paper |
White Paper |
|
International Women in Engineering Day |
2021/06 (Jun) |
White Paper |
White Paper |
|
Electrify Our World™ |
2021/06 (Jun) |
Conference |
APEC |
|
Pulsed ACF for Low-Profile GaN Fast Chargers |
2021/06 (Jun) |
Conference |
APEC |
|
300W Multi-Mode Totem-pole PFCUsing GaN Power ICs |
2021/06 (Jun) |
Conference |
APEC |
|
The Future of Power: High-Frequency Systems Enabled by GaN |
2021/04 (Apr) |
Conference |
Electronica China |
|
Gallium Nitride: Catalyst for the Next Generation of Power |
2021/03 (Mar) |
White Paper |
White paper |
|
Fast Forward to the GaN Data Center |
2021/02 (Feb) |
White Paper |
White paper |
|
GaN: Future Direction & Challenges |
2021/02 (Feb) |
White Paper |
White paper |
|
The GaN Revolution in Fast Charging & Power Conversion |
2021/02 (Feb) |
White Paper |
White paper |
|
The Future of Charging is GaNFast! (English) |
2020/12 (Dec) |
Conference |
Chongdiantou |
|
纳微GaNFast:定义快充新未来!(The Future of Charging is GaNFast!) (Chinese) |
2020/12 (Dec) |
Conference |
Chongdiantou |
|
纳微氮化镓市场分享及展望A New Era in Fast Charging: Let’s Go GaNFast! (Chinese) |
2020/12 (Dec) |
Conference |
SemiExpo |
|
A New Era in Fast Charging: Let’s Go GaNFast! (English) |
2020/12 (Dec) |
Conference |
SemiExpo |
|
GaNFast Power ICs: The Game-Changer |
2020/07 (Jul) |
Conference |
PCIM |
|
GaNFast Power ICs: Past – Present – Future |
2020/07 (Jul) |
Conference |
PCIM |
|
GaN Power ICs Drive Fast Charger Innovation and Market Adoption |
2020/06 (Jun) |
Conference |
SEMICON |
|
Integrated GaN Power Solution and Application (纳微集成氮化镓电源解决方案及应用) (Chinese) |
2020/06 (Jun) |
Conference |
eMakerZone |
|
Gallium Nitride (GaN) Power IC Integration and Application (Chinese) |
2020/05 (May) |
Conference |
Jiwei Wang |
|
High-Density 65W USB-PD GaN Chargers: Market Demand, Technical Solutions and Pricing |
2020/03 (Mar) |
Conference |
APEC |
|
AN011: Thermal Management of NV612x GaNFast Power ICs (gallium nitride) |
2019/12 (Dec) |
App Note |
Application Note |
|
Here Come the GaN Chargers (gallium nitride) |
2019/12 (Dec) |
Conference |
Bodo's Power Conference |
|
CPSSC 2019 GaNFast Charger Update (gallium nitride) (Chinese) |
2019/11 (Nov) |
Conference |
CPSSC |
|
High-Frequency 150W PFC-LLC with GaN Power ICs (gallium nitride) |
2019/11 (Nov) |
Conference |
CPSSC |
|
High-Frequency PFC-LLC with GaN Power ICs (gallium nitride) |
2019/11 (Nov) |
Conference |
CPSSC |
|
GaNFast Power IC Modeling (gallium nitride) |
2019/11 (Nov) |
Conference |
CPSSC |
|
GaN Power ICs Enables a Revolution in AC-DC Adapters (gallium nitride) |
2019/11 (Nov) |
Conference |
CPSSC |
|
GaN Power Integrated Circuits |
2019/06 (Jun) |
Conference |
DRC |
|
GaN High Density 300W AC-DC Converter |
2019/05 (May) |
Conference |
PCIM |
|
System integration benefits of GaN Power ICs (gallium nitride) |
2019/05 (May) |
Conference |
PCIM |
|
Systematic approach to GaN power IC reliability |
2019/03 (Mar) |
Conference |
APEC |
|
Study of Magnetics Frequency vs. Efficiency Enables a New Class of High-Density PFC/LLC Converters |
2019/03 (Mar) |
Conference |
APEC |
|
GaN Power ICs Enabling Next-Gen ACF for Adapter/Charger Applications |
2019/03 (Mar) |
Conference |
APEC |
|
GaN Power IC Adoption Takes Off in Fast Charging Market (gallium nitride) |
2019/03 (Mar) |
Conference |
APEC |
|
Capacitors going GaNFast: Opportunities and Challenges in High-Frequency Power Systems |
2019/03 (Mar) |
Conference |
APEC |
|
A New 650V GaNFast Half Bridge IC for AC/DC Converter Applications (gallium nitride) |
2019/03 (Mar) |
Conference |
APEC |
|
AN010: Thermal Management of GaNFast™ Power ICs |
2019/03 (Mar) |
App Note |
Application note |
|
Delivering Performance, Let’s Go GaNFast! |
2018/12 (Dec) |
Conference |
Bodo's Power Conference |
|
Reliability Testing and Qualification of GaNPower Integrated Circuits |
2018/11 (Nov) |
Conference |
PEAC |
|
GaN Power IC Enable 4x Power Density 150W AC/DC Converter Design |
2018/11 (Nov) |
Conference |
PEAC |
|
Monolithic GaN Device Integration Drives Efficiency,Density and Reliability in Power Conversion |
2018/08 (Aug) |
Conference |
PSMA PTR |
|
Monolithic GaN Device Integration Drives Efficiency |
2018/08 (Aug) |
Conference |
PSMA PTR |
|
GaN Reliability Through Integration and Application Relevant Stress Testing |
2018/03 (Mar) |
Conference |
APEC |
|
Design Considerations of Highly-Efficient Active Clamp Flyback Converter Using GaNFast™ Power ICs |
2018/03 (Mar) |
Conference |
APEC |
|
GaN Power ICs Enable Next Gen Adapters |
2018/01 (Jan) |
Conference |
MEPD Taiwan |
|
GaN Power ICs: Integration Drives Performance |
2017/12 (Dec) |
Conference |
Bodo's Power Conference |
|
From Science Fiction to Industry Fact: GaN Power ICs Enable the New Revolution in Power Electronics |
2017/12 (Dec) |
Article |
Bodo's Power |
|
GaN Power ICs: Device Integration Delivers Application Performance |
2017/11 (Nov) |
Conference |
WiPDA |
|
GaN Power ICs Enable Next-Generation Power Supplies |
2017/11 (Nov) |
Conference |
CPSS |
|
Half-Bridge GaN Power ICs: Performance and Application |
2017/09 (Sep) |
Article |
IEEE Xplore |
|
GaN Power ICs deliver breakthrough system performance with confident project costs and schedules |
2017/05 (May) |
Conference |
PCIM |
|
GaN Power IC Technology: Past, Present & Future |
2017/05 (May) |
Conference |
ISPSD |
|
At the Speed of GaN (gallium nitride) |
2017/04 (Apr) |
Conference |
CPES |
|
Step Up to Half-Bridge GaN Power ICs |
2017/03 (Mar) |
Conference |
Bodo's Power |
|
State-of-the-Art Mobile Charging: Topologies, Technologies and Performance |
2017/03 (Mar) |
Conference |
APEC |
|
Single-Stage 6.78 MHz Power-Amplifier Design Using High-Voltage GaN Power ICs for Wireless Charging Applications |
2017/03 (Mar) |
Conference |
APEC |
|
Next-generation GaN Isolators / Level-Shifters for High Frequency |
2017/03 (Mar) |
Conference |
APEC |
|
Do We Need to Progress Towards GHz Switching in High Power Systems and Applications? |
2017/03 (Mar) |
Conference |
APEC |
|
GaN Power ICs at 1 MHz+:Topologies, Technologies and Performance |
2017/03 (Mar) |
Conference |
APEC |
|
Active Clamp Flyback Using GaN Power IC for Power Adapter Applications |
2017/03 (Mar) |
Conference |
APEC |
|
Take a Practical Path Toward High-Performance Power Conversion |
2017/02 (Feb) |
Article |
Electronic Design |
|
Speed Drives Performance |
2016/11 (Nov) |
Conference |
WiPDA |
|
650V AllGaN™ Power IC for Power Supply Applications (gallium nitride) |
2016/11 (Nov) |
Conference |
WiPDA |
|
Monolithic HV GaN Power ICs: Performance and Application |
2016/09 (Sep) |
Article |
IEEE Xplore |
|
Driving For Zero Switching Losses |
2016/06 (Jun) |
Conference |
PCIM Asia |
|
Welcome to the Post-Silicon World: Wide Bandgap Powers Ahead |
2016/05 (May) |
Conference |
PCIM |
|
Make it Easy with GaN Power ICs |
2016/05 (May) |
Article |
Bodo's Power |
|
GaN Matures for Industry with Monolithic Power ICs |
2016/05 (May) |
Article |
Power Electronics Europe |
|
GaN Power ICs and the High-Frequency Eco-System (gallium nitride) |
2016/04 (Apr) |
Conference |
PSMA PTR |
|
Unlocking the Power of GaN |
2016/03 (Mar) |
Conference |
APEC |
|
Breaking Speed Limits with GaN Power ICs |
2016/03 (Mar) |
Conference |
APEC |
|
Breaking Speed Limits with GaN PowerICs |
2016/03 (Mar) |
Conference |
IEEE TV |
|
AN006: QFN Assembly & Rework |
2013/07 (Jul) |
App Note |
Application note |
|