ASME InterPACK 2025

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.

Presentations:
Jinesh Narangaparambil
“Long-Term-Reliability Analysis of Top Cooled GaN Package Under Thermal Cycling”
October 28th 11:15 am – 12:45 pm PDT