ASME InterPACK 2025
Hotel FERA Anaheim 100 The City Dr S, OrangeInterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Presentations: Jinesh Narangaparambil "Long-Term-Reliability Analysis of Top Cooled GaN Package Under Thermal Cycling" October 28th 11:15 am - 12:45 pm PDT