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InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Presentations: Jinesh Narangaparambil "Long-Term-Reliability Analysis of Top Cooled GaN Package Under Thermal Cycling" October 28th 11:15 am - 12:45 pm PDT |
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Technical Webinar – Dr. Arash Salemi This event is free and does not require registration. Please feel free to share the link with colleagues and students. Where: Online via Zoom When: Wednesday, November 5, from Noon to 1 p.m. (EDT) Topic: 3300 V & 2300 V SiC Trench-Assisted Planar MOSFETs and Compact Power Modules with Epoxy-Resin Potting Technology for Energy Infrastructure Applications |
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WiPDA provides a forum for device scientists, circuit designers, and application engineers to share technology updates, research findings, experience, and potential applications. WiPDA 2025 will feature technical sessions, tutorials, keynotes from industry and research leaders, as well as an exposition. Presentations: Sid Sundaresan & Jaehoon Park “Industry View on the status and challenges for UHV SiC Power Device Technologies” November 11th 8:50 AM - 9:20 AM CST |
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ECPE, the European Center for Power Electronics e.V., founded in 2003, is the leading industry-driven research network in the field of power electronics in Europe, with more than 230 member organizations, including member companies and competence centers. Presentations: Dr. Arash Salemi “Revolutionizing Ultra-High-Voltage Power SiC MOSFETs from 650V to 15kV” November 12th 12:45 PM – 1:15 PM CET |
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