Event

Baird 2025 Global Consumer, Technology & Services ConferenceJune 3, 2025  Fireside Chat 8:30-9:00 ET; 1-on-1 meetings with Gene Sheridan, CEOLocation: InterContinental Barclay  – New York, NYhttps://wsw.com/webcast/baird79/nvts/1971270 Click the PDF below to view the presentation: Navitas Baird Update 2025

Rosenblatt 5th Annual Technology Summit: The Age of AI June 11, 2025 Fireside Chat 10:00-10:45 ET 1-on-1 meetings with Gene Sheridan, CEO, and Todd Glickman, CFO Location: Virtual View here: https://wsw.com/webcast/rblt4/nvts/1788696

August 8, 2025, 9:30 am PT. Live-streamed event with Q&A session REPLAY AVAILABLE HERE: Add to calendar Event Highlights: -Introduction to traditional and next-generation AI data center architectures, powered by GaN and SiC power technologies. -Details on the three critical stages of power delivery required to enable next-generation AI data centers. -Key technologies and advantages across each power stage to achieve the highest energy efficiency, power density, and reliability required by next-generation AI data centers. -Key partners and target customers leading this AI data center opportunity. -Projected power semi market, highlighting GaN and SiC opportunities over the next five years.

The 6th Annual Needham Virtual Semiconductor & SemiCap 1×1 Conference will take place on August 20-21, 2025. Company participants will include some of the most prominent C-level management teams in the Semiconductor and Semiconductor Capital Equipment ecosystems. This event consists of virtual 1×1 and group meetings. 1-on-1 meetings with Gene Sheridan, CEO, and Todd Glickman

August 26, 2025, 1-on-1 meetings with Gene Sheridan, CEO, and Todd Glickman, CFO

Senior executives from leading companies in the technology industry will provide updates to you on their businesses. The format will be focused on more one-on-one / small group meetings in order to connect corporate management teams and investors.  Presentations and panel discussions will also be an agenda highlight. August 28, 2025, 1-on-1 meetings with Gene Sheridan, CEO, and Todd Glickman, CFO

Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025), a premier global event in the semiconductor industry, will bring together more than 1,000 distinguished global exhibitors to showcase the entire industry chain. Spanning from EDA tools, semiconductor materials, equipment manufacturing to chip design and advanced packaging applications. The exhibition features seven dedicated theme pavilions, including Chip Design and Application, IC Fabrication, Wafer Equipment, Advanced Packaging Equipment, Semiconductor Core Part & Raw Material, Compound Semiconductors & Power Devices, AI Computing Power.

The Asia Charging Expo (ACE), is one of the world's most influential energy electronics technology exhibitions and one of the leading charging industry technology events in Asia. Thanks to its strong professionalism and targeted reach of exhibitors and visitors, the Asia Charging Expo enjoys considerable global recognition. It has become a platform for major global power supply companies to release product information and showcase their latest technologies.

ICSCRM 2025 promises an exceptional program, comprising top-tier tutorials, keynote lectures, and an array of oral and poster presentations, all backed by the Technical Program Committee. In addition to the technical program, an exhibition showcasing the latest technologies and products in the field of silicon carbide and related materials will run concurrently. Event Details: Booth: #092 Presentations: Sid Sundaresan - Session Chair "Devices Physics, Design, and Characterization" September 16th 2:45pm - 4:15pm KST Arash Salemi "Benchmark Study of State-of-The-Art Commercial 1200V SiC MOSFETs for Automotive Applications" September 17th 4:30pm - 6:30pm KST

electronica India gathers international and local market leaders from the industry, displays products, addresses all important target groups and thus creates the best communication and business environment for both sides. Event Details: Navitas x JPE Booth: Hall 5, #D21

The ECCE 2025 Conference will feature both industry-driven and application-oriented technical sessions, as well as expositions. ECCE will bring together practicing engineers, researchers and other professionals for interactive and multidisciplinary discussions on the latest advances in various areas related to energy conversion.

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Presentations: Jinesh Narangaparambil "Long-Term-Reliability Analysis of Top Cooled GaN Package Under Thermal Cycling" October 28th 11:15 am - 12:45 pm PDT