Navitas presentations: Tuesday 21st March 8:30 AM – 11:55 AM ETIS06 - Other Perspectives of Power Electronics - Markets, Society and Policies Industry Session Chair: Stephen Oliver, MBA – Navitas Semiconductor 9:45 AM – 10:10 AM ETIS06.4 - The Past, Present, and Future of Current Sensing Industry Session Presenter: John Stevens – Navitas Semiconductor 10:40 AM – 11:05 AM ETIS06.5 - Sustainability Benefits of GaNFast Power ICs Industry Session Presenter: Anthony Schiro – Navitas Semiconductor 2:15 PM – 2:45 PM - Pure-Play, High-Speed GaNFast and GeneSiC: The Leading Edge of Next-Gen Power Semiconductors Location: W202B Wednesday 22nd March 8:30 AM – 11:55 AM ETIS08 - Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count Industry Session Chair: Llew Vaughan-Edmunds – Navitas Semiconductor 12:45 PM – 1:15 PM - GeneSiC high-speed, high-voltage SiC drives high-power innovation Location: W206A, Speaker: Sumit Jadav – GeneSiC Semiconductor 2:30 PM – 2:50 PM ET T23.4 - An Ultra-High Efficiency High Power Density 140W PD3.1 AC-DC Adapter Using GaN Power ICs Technical Session Presenter: Xiucheng Huang/Jason Zhang Thursday 23rd March 9:45 AM – 10:10 AM ETIS19.4 - New GaNSense Half-Bridge IC Enables Next Gen High-Frequency, High-Efficiency, High-Density Topologies Industry Session Presenter: Tom Ribarich – […]
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From March 28 to 30, this Virtual Conference and Exhibition will shed light on the pitfalls and challenges facing new vehicle designs and suggest strategies and solutions for car designers. The exhibition area of the Advanced Automotive Tech Forum will open doors on March 28 at 14:00 CEST/Paris time (8:00am EDT/New York time) and stay open during the whole event. The technical conference will have tracks with Keynotes, Panel Discussions and Technical Presentations. Conference hours are on March 28-30 from 14:00 - 20:00 CEST/Paris Time (8:00am - 2:00pm EDT/New York Time). Dan Kinzer, Co-Founder & Chief Technology Officer/Chief Operating Officer, To present: Efficient 400-800V Charging and Conversion with no-compromise GaN Power ICs and Trench-Assisted Planar Gate SiC March 28 2:10 pm - 3:10 pm BST
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ECPE 2023 Hybrid Workshop & ECPE Annual Event ECPE SiC & GaN User Forum – Potential of Wide Bandgap Semiconductors in Power Electronic Applications
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Tuesday 9th May • “GaN Power ICs Drive Efficiency and Size Improvements in BLDC Motor Drive Applications.”, - 11.40am: GaN Devices Session, Brüssel 1, Alfred Hesener, Senior Director, Industrial Applications • “GaN Power ICs Enable 300cc 700kHz 300W AC-DC Converter.” - 11.40am: Power IC Session, München 2, Tom Ribarich, Senior Director Strategic Marketing • “GaN-based High-Frequency, High-Power-Density, 2-in-1 Bi-directional OBCM Design for EV Applications.” - Power Electronics for Electric Cars Poster Session, Foyer, NCC Mitte, Bin Li, Senior Applications Manager, for Minli Jia, Sr. Staff Applications Engineer Wednesday 10th May • “Wide Bandgap Design with GaN HEMT and Vertical GaN.” (panel) - 1:05pm, Hall 7, #480, Stephen Oliver, VP Corporate Marketing & Investor Relations Thursday 11th May • “Reliability and Quality Requirements for SiC and GaN Power Devices.” (panel) - 12:10pm, Hall 7, #480, Stephen Oliver, VP Corporate Marketing & Investor Relations • “High-Frequency High-Efficiency LLC Module with Planar Matrix Transformer for CRPS Application Using GaN Power IC.” - 2:20pm, DC-DC Converters Session, Brüssel 1, Bin Li, Senior Applications Manager
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Tuesday 9th May • “GaN Power ICs Drive Efficiency and Size Improvements in BLDC Motor Drive Applications.”, - 11.40am: GaN Devices Session, Brüssel 1, Alfred Hesener, Senior Director, Industrial Applications • “GaN Power ICs Enable 300cc 700kHz 300W AC-DC Converter.” - 11.40am: Power IC Session, München 2, Tom Ribarich, Senior Director Strategic Marketing • “GaN-based High-Frequency, High-Power-Density, 2-in-1 Bi-directional OBCM Design for EV Applications.” - Power Electronics for Electric Cars Poster Session, Foyer, NCC Mitte, Bin Li, Senior Applications Manager, for Minli Jia, Sr. Staff Applications Engineer Wednesday 10th May • “Wide Bandgap Design with GaN HEMT and Vertical GaN.” (panel) - 1:05pm, Hall 7, #480, Stephen Oliver, VP Corporate Marketing & Investor Relations Thursday 11th May • “Reliability and Quality Requirements for SiC and GaN Power Devices.” (panel) - 12:10pm, Hall 7, #480, Stephen Oliver, VP Corporate Marketing & Investor Relations • “High-Frequency High-Efficiency LLC Module with Planar Matrix Transformer for CRPS Application Using GaN Power IC.” - 2:20pm, DC-DC Converters Session, Brüssel 1, Bin Li, Senior Applications Manager
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Frost & Sullivan's Think Tank program - a virtual event which aims to bring the industry stakeholders onto one platform to discuss the topics of common interest for the betterment of the market. Navitas Semiconductor's Think Tank session on "WBG Semiconductors: Overcoming Challenges, Unlocking Potential" is scheduled for 10 Am EDT on the 28th of July.
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International trade fair for electronic components, systems, applications and solutions.
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International trade fair for electronic components, systems, applications and solutions.
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Frost & Sullivan's Think Tank program - a virtual event which aims to bring the industry stakeholders onto one platform to discuss the topics of common interest for the betterment of the market. Navitas Semiconductor's Think Tank session on "WBG Semiconductors: Overcoming Challenges, Unlocking Potential" is scheduled for 10 Am EDT on the 28th of July.
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