The ECCE 2025 Conference will feature both industry-driven and application-oriented technical sessions, as well as expositions. ECCE will bring together practicing engineers, researchers and other professionals for interactive and multidisciplinary discussions on the latest advances in various areas related to energy conversion.
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InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Presentations: Jinesh Narangaparambil "Long-Term-Reliability Analysis of Top Cooled GaN Package Under Thermal Cycling" October 28th 11:15 am - 12:45 pm PDT
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Technical Webinar – Dr. Arash Salemi This event is free and does not require registration. Please feel free to share the link with colleagues and students. Where: Online via Zoom When: Wednesday, November 5, from Noon to 1 p.m. (EDT) Topic: 3300 V & 2300 V SiC Trench-Assisted Planar MOSFETs and Compact Power Modules with Epoxy-Resin Potting Technology for Energy Infrastructure Applications
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WiPDA provides a forum for device scientists, circuit designers, and application engineers to share technology updates, research findings, experience, and potential applications. WiPDA 2025 will feature technical sessions, tutorials, keynotes from industry and research leaders, as well as an exposition. Presentations: Sid Sundaresan “Industry View on the status and challenges for UHV SiC Power Device Technologies”
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Watch out for further announcements in the magazine and on Bodo's Power Systems digital channels about the WBG Event 2025!
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