• ASME InterPACK 2025

    Hotel FERA Anaheim 100 The City Dr S, Orange, CA, United States

    InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Presentations: Jinesh Narangaparambil "Long-Term-Reliability Analysis of Top Cooled GaN Package Under Thermal Cycling" October 28th 11:15 am - 12:45 pm PDT

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  • PowerAmerica Technical Webinar

    Virtual

    Technical Webinar – Dr. Arash Salemi This event is free and does not require registration. Please feel free to share the link with colleagues and students. Where: Online via Zoom When: Wednesday, November 5, from Noon to 1 p.m. (EDT) Topic: 3300 V & 2300 V SiC Trench-Assisted Planar MOSFETs and Compact Power Modules with Epoxy-Resin Potting Technology for Energy Infrastructure Applications

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  • Wide Bandgap Power Devices and Applications (WiPDA 2025)

    Fayetteville Fayetteville, AR, United States

    WiPDA provides a forum for device scientists, circuit designers, and application engineers to share technology updates, research findings, experience, and potential applications. WiPDA 2025 will feature technical sessions, tutorials, keynotes from industry and research leaders, as well as an exposition. Presentations: Sid Sundaresan & Jaehoon Park “Industry View on the status and challenges for UHV SiC Power Device Technologies” November 11th 8:50 AM - 9:20 AM CST

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  • ECPE Hybrid Workshop 2025

    Lyon Lyon, France

    ECPE, the European Center for Power Electronics e.V., founded in 2003, is the leading industry-driven research network in the field of power electronics in Europe, with more than 230 member organizations, including member companies and competence centers. Presentations: Dr. Arash Salemi “Revolutionizing Ultra-High-Voltage Power SiC MOSFETs from 650V to 15kV” November 12th 12:45 PM – 1:15 PM CET

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  • Bodo’s Wide Bandgap Event 2025

    Hilton Munich Airport Terminalstraße Mitte 20, 85356 München-Flughafen, Germany

    Presentations: Llew Vaughan-Edmunds “Bodo's WBG - Opening Roundtable” December 2nd 4:00 PM ~ 5:30 PM CET Llew Vaughan-Edmunds “High-Power GaN ICs & FETs Enable Efficiency and Power Density Requirements in Next Gen 800V AI Data Centers” December 3rd 11:45 AM - 12:00 PM CET Sascha Dern “Performance and Reliability Gains in MVHV SiC Using Advanced Power Devices and Packaging Technologies” December 3rd 2:30 PM - 2:45 PM CET

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