by Navitas | Mar 8, 2023 | Front Page, In the Media, Latest News, Short post
Another reason why gallium nitride is so reliable inherently stems from its lateral device structure. “We can integrate protection functions monolithically on the chip, which is simply impossible with vertical power devices, i.e., neither silicon nor silicon...
by Navitas | Mar 7, 2023 | Front Page, Latest News, Press Releases
Expansion of technology, markets and geography positions Navitas for scale to replace legacy silicon chips in $22B/year market opportunity Torrance, CA – March 7th, 2023: Navitas Semiconductor (Nasdaq: NVTS), the industry leader in next-generation power...
by Navitas | Feb 23, 2023 | Front Page, IR, IR Financial, Latest News, Press Releases
60% Revenue Growth in 2022 Diversification of Technology, End Markets and Geography Positions Navitas for Scale Displacing Legacy Silicon in Power Electronics; Enabling Electrification of New Growth Markets Torrance, Calif., Feb. 23, 2023. Navitas...
by Navitas | Feb 17, 2023 | Front Page, In the Media, Latest News, Short post, Solar News
“Navitas Semiconductor and KATEK Group have announced that KATEK’s coolcept fleX series of Steca solar inverters have embraced new GeneSiC power semiconductors for enhanced efficiency, size, weight and cost, as well as considerable market expansion. Through the...
by Navitas | Feb 17, 2023 | Front Page, In the Media, IR, IR Financial, Latest News, Short post
“Navitas Semiconductor announced an agreement to acquire the remaining minority interest in its silicon control IC joint venture from Halo Microelectronics for a purchase price of $20 million in Navitas stock.” In 2021, Navitas and Halo created a joint...
by Navitas | Feb 15, 2023 | CES23Feat, Front Page, In the Media, Latest News, Short post
“At CES 2023, Navitas Semiconductor invited CES attendees to discover how next-generation gallium nitride (GaN) and silicon carbide (SiC) technologies are playing a vital role in delivering global sustainability by enabling fully-electrified housing,...
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