by Navitas | Jun 8, 2026 | Latest-News, Press-Releases
Direct-cooled thermal management offered by a reflow-compatible, isolated thermal pad significantly improves power density, reliability, and efficiency. Integrated aluminum nitride substrate-based isolation reduces electromagnetic coupling, allowing higher switching...
by Navitas | Jun 3, 2026 | AI PR, Latest-News, Press-Releases
TORRANCE, CA – Jun 3rd, 2026 — Navitas Semiconductor (Nasdaq: NVTS), an industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, was honored to participate in NVIDIA’s Partner Ceremony held on May...
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